Luoyang Dingming Optical Technology Co.,Ltd.

Semiconductor wafers

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Semiconductor wafers

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Silicon rods and semiconductor wafers

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Email:lydm@dm-optical.com

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Product description

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Silicon polished sections are widely used in various fields of semiconductors, Dingming Optoelectronics has the ability to process 2-8 inch semiconductor monocrystalline silicon wafers, The quality of our products is checked at all levels, in the hope of providing customers with the highest quality products.

Name	Silicon wafer
Growth Pattern	CZ or FZ
Type	P or N
Orientation	<100>or<111>
Diameter	2-8 inch
Tolerance	±5mm
Thickness	180-2000μm
Tolerance	±10μm
Dislocation Density(pcs/C㎡)	None
Resistivity	0.001-10000 Ω.cm
Purity	6N-9N

PARAMETER	UNIT	KORVXQ2B
GRADE	Prime	Prime
GROW METHOD	CZ	CZ
TYPE		P
DOPANT		Boron
XTAL ORIENTATION	DEGREES	1-0-0
RESISTIVITY CTR	W·CM	10.0-20.0
RRG 1 CTR-1/2R MAX	﹪	/
RRG 2 C-6mm MAX	﹪	8.0
SLICE ORIENTATION	DEGREES	1-0-0±0.5°
OXYGEN CTR	NEW PPMA	13.0-19.0
ORG MAX	﹪	/
PRIMARY FLAT LOCATION	DEGREES	1-1-0±0.5°
PRIMARY FLAT LENGTH	MM	32.5±2.5
SECONDARY FLAT LOCATION	DEGREES	N/A
SECONDARY FLAT LENGTH	MM	/
CARBON CTR MAX	PPMA	1.0
TTV MAX	MICRONS	15.0
BOW MAX	MICRONS	40.0
WARP MAX	MICRONS	40.0
EDGE CONTOUR		SEMI STD.
FS PARTICLE	LIGHT	/
SIZE MAX	MICRONS	0.5
MAX	#/SL	10.0
DISLOCATION	#/Sq c㎡	100.0
OISF MAX	#/Sq c㎡	100.0
LASER MARK		N/A
GLOBAL TIR MAX	MICRONS	5.0
SITE TIR MAX	MICRONS	/
SLICE BACK		Etched
CUSTOMER PART NO		4-thk1000-ssp
PACKAGE	standard packaging	UPACK A 25片/box
REMARKS	Other unlisted parameters are executed according to SEMI standards