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Semiconductor wafers

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Product description
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 Silicon polished sections are widely used in various fields of semiconductors, Dingming Optoelectronics has the ability to process 2-8 inch semiconductor monocrystalline silicon wafers, The quality of our products is checked at all levels, in the hope of providing customers with the highest quality products.

 

Name

Silicon wafer

Growth Pattern

CZ or FZ

Type

P or N

Orientation

<100>or<111>

Diameter

2-8 inch

Tolerance

±5mm

Thickness

180-2000μm

Tolerance

±10μm

Dislocation Density(pcs/C㎡)

None

Resistivity

0.001-10000 Ω.cm

Purity

6N-9N

 

PARAMETER

UNIT

KORVXQ2B

GRADE

 Prime

Prime

GROW METHOD

CZ

CZ

TYPE

 

P

DOPANT

 

Boron

XTAL ORIENTATION

DEGREES

1-0-0

RESISTIVITY CTR

W·CM

10.0-20.0

RRG 1 CTR-1/2R MAX

/

RRG 2 C-6mm MAX

8.0

SLICE ORIENTATION

DEGREES

1-0-0±0.5°

OXYGEN CTR      

NEW PPMA

13.0-19.0

ORG MAX

/

PRIMARY FLAT LOCATION

DEGREES

1-1-0±0.5°

PRIMARY FLAT LENGTH

MM

32.5±2.5

SECONDARY FLAT LOCATION

DEGREES

N/A

SECONDARY FLAT LENGTH

MM

/

CARBON CTR MAX

PPMA

1.0

TTV MAX        

MICRONS

15.0

BOW MAX       

MICRONS

40.0

WARP MAX

MICRONS

40.0

EDGE CONTOUR

 

SEMI STD.

FS PARTICLE

LIGHT

 /

SIZE MAX

MICRONS

0.5

MAX

#/SL

10.0

DISLOCATION

#/Sq c㎡ 

100.0

OISF MAX

#/Sq c㎡ 

100.0

LASER MARK

 

N/A

GLOBAL TIR MAX

MICRONS

5.0

SITE TIR MAX

MICRONS

/

SLICE BACK

 

Etched

CUSTOMER PART NO

 

4-thk1000-ssp

PACKAGE

standard packaging

 UPACK A 25片/box

REMARKS

Other unlisted parameters are executed according to SEMI standards

 

We could not find any corresponding parameters, please add them to the properties table
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 Luoyang Dingming Optical Technology Co.,Ltd.

Address:Hangong Road, Xigong Industrial Park, 
                   Xigong District, Luoyang HeNan,China

Email:lydm@dm-optical.com

Tel:+86-379-62110001

Fax:+86-379-62112223

 

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