Semiconductor wafers
Silicon polished sections are widely used in various fields of semiconductors, Dingming Optoelectronics has the ability to process 2-8 inch semiconductor monocrystalline silicon wafers, The quality of our products is checked at all levels, in the hope of providing customers with the highest quality products.
|
Name |
Silicon wafer |
|
Growth Pattern |
CZ or FZ |
|
Type |
P or N |
|
Orientation |
<100>or<111> |
|
Diameter |
2-8 inch |
|
Tolerance |
±5mm |
|
Thickness |
180-2000μm |
|
Tolerance |
±10μm |
|
Dislocation Density(pcs/C㎡) |
None |
|
Resistivity |
0.001-10000 Ω.cm |
|
Purity |
6N-9N |
|
PARAMETER |
UNIT |
KORVXQ2B |
|
GRADE |
Prime |
Prime |
|
GROW METHOD |
CZ |
CZ |
|
TYPE |
|
P |
|
DOPANT |
|
Boron |
|
XTAL ORIENTATION |
DEGREES |
1-0-0 |
|
RESISTIVITY CTR |
W·CM |
10.0-20.0 |
|
RRG 1 CTR-1/2R MAX |
﹪ |
/ |
|
RRG 2 C-6mm MAX |
﹪ |
8.0 |
|
SLICE ORIENTATION |
DEGREES |
1-0-0±0.5° |
|
OXYGEN CTR |
NEW PPMA |
13.0-19.0 |
|
ORG MAX |
﹪ |
/ |
|
PRIMARY FLAT LOCATION |
DEGREES |
1-1-0±0.5° |
|
PRIMARY FLAT LENGTH |
MM |
32.5±2.5 |
|
SECONDARY FLAT LOCATION |
DEGREES |
N/A |
|
SECONDARY FLAT LENGTH |
MM |
/ |
|
CARBON CTR MAX |
PPMA |
1.0 |
|
TTV MAX |
MICRONS |
15.0 |
|
BOW MAX |
MICRONS |
40.0 |
|
WARP MAX |
MICRONS |
40.0 |
|
EDGE CONTOUR |
|
SEMI STD. |
|
FS PARTICLE |
LIGHT |
/ |
|
SIZE MAX |
MICRONS |
0.5 |
|
MAX |
#/SL |
10.0 |
|
DISLOCATION |
#/Sq c㎡ |
100.0 |
|
OISF MAX |
#/Sq c㎡ |
100.0 |
|
LASER MARK |
|
N/A |
|
GLOBAL TIR MAX |
MICRONS |
5.0 |
|
SITE TIR MAX |
MICRONS |
/ |
|
SLICE BACK |
|
Etched |
|
CUSTOMER PART NO |
|
4-thk1000-ssp |
|
PACKAGE |
standard packaging |
UPACK A 25片/box |
|
REMARKS |
Other unlisted parameters are executed according to SEMI standards |
|
keyword:
Semiconductor wafers